EFG-AC series

EFG-AC series (thickness: 0.168-3mm)

This series is a combination of graphite-aluminum substrate with high-stickiness thermal conductive adhesive. It is suitable for heat dissipation solution that requires high-stickiness. If there is no space available for fixing the heat sink, the high-stickiness adhesive produced by Ever Full Electronic can be used to fix the heat sink. In General, this heat dissipation solution is most suitable for solving the problem of insufficient heat dissipation space when the EMI shielding has height restrictions or no fasteners are designed.